doc. no : qw0905-ldgm4843/tbf-x rev. : a date : 29 - sep. - 2009 tape and box type led lamps ldgm4843/tbf-x data sheet pb lead-free parts ligitek electronics co.,ltd. property of ligitek only l dcc
+ - 1.0 3.8 3.0 3.8 note : 1.all dimension are in millimeter tolerance is
note : 1.the forward voltage data did not including ? ? v
ligitek electronics co.,ltd. property of ligitek only maxmum overall thickness50 h60 1.97 ldgm4843/tbf-x part no. quantity/box 2000pcs dimensions symbol information ? ??? ?? ?? ??? ??? ?? ?? ????????? ? ? ??? ???? ????? ?? ????? ? ?? ??? ??? ? ? ???? ? ???
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ?? ?
page5/6 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 150 time(sec) 260 260 100 50 preheat 120 25 0 0
description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. 1.t.sol=230 ?
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